Through-Silicon Vias for 3D Integration

by John H. Lau

2012 · McGraw Hill Professional

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging

Advanced MEMS Packaging

by John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

2009 · McGraw Hill Professional

A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

Assigning Structures to Ions in Mass Spectrometry

by John L. Holmes, Christiane Aubry, Paul M. Mayer

2006 · CRC Press

Assigning Structures to Ions in Mass Spectrometry describes the tools currently available for determining gas-phase ion structures. It surveys current experimental methods for ion production and separation as well as those designed to reveal qualitative and quantitative aspects of gas-phase ions. It also examines how and when to apply computational chemistry and theoretical calculations. Selected case studies illustrate specific challenges associated with ion structure assignment and thermochemical problems. Bringing together key results collected over the past four decades, the book contains the data for describing or identifying ions containing C alone and C with H, O, N, S, P, halogens, and small organic cations.

Return Distributions in Finance

by Stephen Satchell, John Knight

2000 · Elsevier

Quantitative methods have revolutionised the area of trading, regulation, risk management, portfolio construction, asset pricing and treasury activities, and governmental activity such as central banking. One of the original contributions in this area is the classic by Cootner entitled 'The Random Nature of Stock Market Prices'. This work investigated the statistical properties of asset prices and was one of the first works to investigate this area in a rigorous manner. Much has happened in this field in the last 35 years and 'Return Distributions in Finance' contains much new information that reflects this huge growth. The authors combined experience reflects not only the new theory but also the new practice in this fascinating area. The rise of financial engineering now allows us to change the nature of asset returns to whatever pattern we desire, albeit at a cost. Benefits and costs can only be understood if we understand the underlying processes. 'Return Distributions in Finance' allows us to gain that understanding. - Assists in understanding asset return distributions - Provides a full overview of financial risk management techniques in asset allocation - Demonstrates how to use asset return forecast applications

Electrophysiological Disorders of the Heart E-Book

by Sanjeev Saksena, A. John Camm

2011 · Elsevier Health Sciences

The new edition of Electrophysiological Disorders of the Heart helps you diagnose and treat a full range of heart rhythm disorders using today’s latest technologies and therapies. It provides practical, hands-on coverage of hot topics such as pediatric EP, imaging, echocardiography-guided EP procedures, regenerative therapies, cardiac pacing, and more. Now available in a new full-color format, the title also includes easy online access at www.expertconsult.com. Discover new ways to treat and manage the full range of heart rhythm disorders with content focused on common clinical features, diagnosis, and management. Review expert management strategies to help you handle complex patient problems. Stay current with the latest molecular and technical advances as well as new treatment options implemented over the last few years. Use the latest technologies and devices to accurately diagnose and manage heart rhythm disorders. Consult new and expanded coverage of regenerative therapies, echo-guided procedures, cardiac pacing, and CRT, as well as a new section on pediatric electrophysiology and imaging. Enjoy improved visual guidance with many new full-color images. Log on to www.expertconsult.com to easily search the complete contents online and access a downloadable image library.